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Samsung-Foundry X-Cube-Press-Release main-2D-IC-vs-3D-IC FF
agosto 14, 2020 - Samsung
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Samsung Announces Availability of its Silicon-Proven 3D IC Technology for High-Performance Applications

Comunicato Stampa disponibile solo in lingua originale. Samsung 'X-Cube' enables industry-first 3D SRAM-logic working silicon at 7nm and beyond.Bandwidth and density can be scaled to suit diverse desi...

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